RLV12 Building Instructions
Adjusting the PCB
I ordered the PCB without chamfered edge for the PCB connector so you have to do it yourself. Use a large fine file and make sure that you do not file the contacts but just the edge.
Often I have found that the edge connectors are slightly too wide. It is very difficult to insert and remove the card. Therefore you need to file the four sides a little bit until it inserts and removes without effort. I assume it is also better for the Q-Bus slots.
BOM
Name | Value | Package | Description |
C1 | 10uF | SMC C | Decoupling Capacitor |
C2 | 10uF | SMC C | Decoupling Capacitor |
C3 | 10uF | SMC C | Decoupling Capacitor |
C4 | 10uF | SMC C | Decoupling Capacitor |
C5 | 10uF | SMC C | Decoupling Capacitor |
C6 | 100nF-330nF | SMD 0805 | Decoupling Capacitor |
C7 | 10uF | SMC C | Decoupling Capacitor |
C8 | 100nF-330nF | SMD 0805 | Decoupling Capacitor |
C9 | 10uF | SMC C | Decoupling Capacitor |
C10 | 100nF-330nF | SMD 0805 | Decoupling Capacitor |
C11 | 100nF-330nF | SMD 0805 | Decoupling Capacitor |
C12 | 100nF-330nF | SMD 0805 | Decoupling Capacitor |
C13 | 22pF | SMD 0805 | XTAL Load Capacitor |
C14 | 22pF | SMD 0805 | XTAL Load Capacitor |
C15 | 10uF | SMC C | Decoupling Capacitor |
C16 | 100nF-330nF | SMD 0805 | Decoupling Capacitor |
C17 | 100nF-330nF | SMD 0805 | Decoupling Capacitor |
C18 | 100nF-330nF | SMD 0805 | Decoupling Capacitor |
C19 | 100nF-330nF | SMD 0805 | Decoupling Capacitor |
C20 | 10uF | SMC C | Decoupling Capacitor |
C21 | 100nF-330nF | SMD 0805 | Decoupling Capacitor |
C22 | 100nF-330nF | SMD 0805 | Decoupling Capacitor |
C23 | 100nF-330nF | SMD 0805 | Decoupling Capacitor |
C24 | 100nF-330nF | SMD 0805 | Decoupling Capacitor |
C25 | 100nF-330nF | SMD 0805 | Decoupling Capacitor |
C26 | 100nF-330nF | SMD 0805 | Decoupling Capacitor |
C27 | 47-220uF | SMC C | Decoupling Capacitor |
IC1 | ATF1508AS-10AU100 | TQFP-100 | 128 Macrocell CPLD 5V standard power |
IC2 | DC005N | DIP-20 | Quad Universal Unified Bus Transceiver |
IC3 | DC005N | DIP-20 | Quad Universal Unified Bus Transceiver |
IC4 | DC005N | DIP-20 | Quad Universal Unified Bus Transceiver |
IC5 | DC005N | DIP-20 | Quad Universal Unified Bus Transceiver |
IC6 | 74HC4050 | SOIC-16 | Hex Buffer used as SD-Card Level Shifter |
IC7 | REG1117 | SOT223 | 3V3 LDO Voltage Regulator |
IC8 | ATMEGA1284P-20PU | DIL-40 | Atmel/Microchip 8-bit MCU |
X1 | 22.1184MHz | HC49 | 22.1184MHz Crystal |
X2 | 2x3-Pin Shrouded Header | AVR ISP for MCU | |
X3 | 2x5-Pin Shrouded Header | CPLD JTAG | |
X4 | |||
E1 | 74S38D | SOIC-14 | Quad Dual-NAND with high current O.C. output |
E2 | 74S38D | SOIC-14 | Quad Dual-NAND with high current O.C. output |
E3 | 74S38D | SOIC-14 | Quad Dual-NAND with high current O.C. output |
E4 | 74S38D | SOIC-14 | Quad Dual-NAND with high current O.C. output |
E5 | DS8837M | SOIC-16 | Hex Unified Bus Receiver |
E6 | DS8837M | SOIC-16 | Hex Unified Bus Receiver |
R1 | 2k2 | SMD 0805 | Pull-Up resistor for MISO (SD-Card Data Out) |
R2 | 0Ohm | SMD 0805 | Optional to source power via USB Serial Adapter |
R3 | 330Ohm | SMD 0805 | Termination Resistor |
R4 | 680Ohm | SMD 0805 | Termination Resistor |
R5 | 330Ohm | SMD 0805 | Termination Resistor |
R6 | 680Ohm | SMD 0805 | Termination Resistor |
R7 | 2k2 | SMD 0805 | SD-Card Pull-Up (not really required) |
R8 | 2k2 | SMD 0805 | SD-Card Pull-Up (not really required) |
U$2 | YAMAICHI-FPS-009-2405-0 | SDMMC | SD-Card Slot Push-Push |
JP6 | 4-Pin single row header | MCU UART interface | |
Socket | DIL-16 | Socket for IC2 (optional) | |
Socket | DIL-16 | Socket for IC3 (optional) | |
Socket | DIL-16 | Socket for IC4 (optional) | |
Socket | DIL-16 | Socket for IC5 (optional) | |
Socket | DIL-40 | Socket for IC8 (optional) |
Assembly
As always with SMD soldering you must start with the flattest parts. I typically start with the TQFP-100 packages. Next are the SMD 0805 sized capacitors and resistors followed by the SD-Card cage. The SD-Card cage has two solder points at the entry side which you must solder to the ground. Be careful to not overheat the card cage in order to not destroy the inlaid plastic.
Next are all other SMD parts like the Tantalum capacitors and the rest of the SOIC packages. Finally you can mount all through hole parts and sockets.
You should carefully inspect all soldering points, especially the TQFP-100 package. Make sure that there are no solder bridges and that all pins are perfectly soldered to the pads and have contact. The later is more of a problem to me than the first. I use small pins to test every pad.
Initial Setup
Power Check
For DIL packages I normally use sockets and I install the necessary software and design files before adding the DIL parts. Here is a picture of a fully assembled emulator without the four DC005 ICs.
Before you insert the emulator you need to program the CPDL and the processor. You can get the files in the download section. Use an external 5V power source. Check first that the power consumption is within reasonable limits. As next you can hook up the CPLD programmer and load the JEDEC file and then you program the microcontroller using the HEX file.